In this study, an attempt has been made to fabricate CueSiC nanocomposites by flake
powder metallurgy and high-pressure torsion processing techniques at room temperature.
Pure Cu and a mixture of Cu and nano-sized SiC powders were mechanically milled
separately for 3 h and then green compacts were prepared by uniaxial pressing under 1 GPa
pressure. The green compacts experienced 6-turn high-pressure torsion under a pressure
of 6 GPa to prepare bulk Cu and CueSiC samples. The microstructures of the consolidated
samples were characterized using an X-ray diffractometer and a high resolution scanning/
transmission electron microscope, and the mechanical properties were evaluated by
microhardness, tensile and wear tests. The results show that almost full density samples
with ultrafine-grained (UFG) microstructure and well-dispersed nanoparticles in the metal
matrix were obtained by the method used. The addition of the nanoparticles reduced the
grain size and microstructural gradient between the center and edges of the disk samples.
SiC nanoparticles improved copper microhardness by 35%, yield strength by 23% and
tensile strength by 9% by implementing various strengthening mechanisms. The produced
material showed a reduced coefficient of friction and high wear resistance. Delamination
was determined as the major wear mechanism in HPTed CueSiC nanocomposite.