In this paper, the thermal stability and grain growth kinetics of nanocrystalline Cu, reinforced with SiC nanoparticles and obtained using a mechanical milling process, were investigated during isothermal annealing. The presence of the nanoparticles in the nanocrystalline copper matrix resulted in a significant decrease in grain growth, the formation of partially textured microstructure and twin boundaries at higher temperatures, and an increase in the volume fraction of recrystallized grains, as estimated by grain orientation spread, in comparison to unreinforced Cu during annealing. The lower volume fraction of recrystallized grains at higher temperatures was attributed to dynamic recovery. Normal grain growth was observed in the annealing range of 400–600 °C, and significant abnormal grain growth was observed at higher temperatures. An analysis of the grain growth kinetics in the temperature range of 400–600 °C revealed a time exponent of n ≈ 3.6 and activation energy of ≈ 34 kJ mol− 1, based on the parabolic equation. The calculated activation energy for grain growth in the SiC dispersion strengthened Cu was found to be less than that of nanocrystalline Cu. The low activation energy and high thermal stability were attributed to high lattice strain and the retarding effect of nanoparticles by the Zener mechanism.
