The demand for advanced materials such as silicon carbide particles reinforced copper matrix composites (Cu-SiC) is increasing due to the stringent design requirement in the electronic packaging, mechanical relays, welding electrodes, electrical contacts, contactors, switches, and circuit breaks industries. High interest in Cu-SiC composites is highlighted by combining high thermal and electrical conductivity with mechanical strength, mouldability, and low production cost. Two decades of intensive research have provided a wealth of new scientific knowledge on the intrinsic and extrinsic effects of SiC reinforcement vis-à-vis mechanical, tribological, thermal, and electrical properties of copper. This paper is intended to provide a comprehensive and critical review of the state-of-the-art scientific research related to processing, effective parameters, and strategies to modify the Cu-SiC interface in these composites and covers comprehensive aspects related to the microstructural, mechanical, tribological, thermal, and electrical properties of Cu-SiC composites.
